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NTHS4166N
Power MOSFET
30 V, 8.2 A, Single N-Channel,
ChipFET t Package
Features
? Trench Technology
? Low R DS(on) to Minimize Conduction Losses
? Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6
? Excellent Thermal Capabilities
? This is a Pb-Free Device
Applications
? Load Switching
? DC-DC Converters
? Low Side Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) Max
22 m W @ 10 V
27 m W @ 4.5 V
D
G
I D Max
8.2 A
Parameter
Symbol
Value
Unit
Drain-to-Source Voltage
Gate-to-Source Voltage
V DSS
V GS
30
± 20
V
V
S
N-Channel MOSFET
Continuous Drain
Current R q JA (Note 1)
T A = 25 ° C
T A = 85 ° C
I D
6.6
4.8
A
MARKING DIAGRAM
Power Dissipation
R q JA (Note 1)
Steady
T A = 25 ° C
P D
1.5
W
8
AND PIN ASSIGNMENT
D D D S
Continuous Drain
Current R q JA (Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JA , t v 5 s
(Note 1)
Power Dissipation
State
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
I D
P D
4.9
3.6
0.8
8.2
5.9
2.2
A
W
A
W
1 466 M
ChipFET G
CASE 1206A 1
D D D G
STYLE 1
466 = Specific Device Code
M = Month Code
G = Pb-Free Package
R q JA (Note 1)
Pulsed Drain Current
TA = 25 ° C,
t p = 10 m s
I DM
32
A
ORDERING INFORMATION
Operating Junction and Storage Temperature
Source Current (Body Diode) R q JF
T J ,
T STG
I S
-55 to
150
2.6
° C
A
Device
NTHS4166NT1G
Package
ChipFET
(Pb-Free)
Shipping ?
3000/Tape & Reel
Single Pulse Drain-to-Source Avalanche
Energy T J = 25 ° C, V DD = 50 V, V GS = 10 V,
I L = 20 A pk , L = 0.1 mH, R G = 25 W
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
EAS
T L
20
260
mJ
° C
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq. pad, 1 oz Cu.
2. Surface Mounted on FR4 Board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2007
December, 2007 - Rev. 0
1
Publication Order Number:
NTHS4166N/D
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